English
Español
tiếng việt
русский
High-purity, 100% molten hexamethylenediamine (HMD) with no solvents or diluents.
Low viscosity and excellent flow characteristics for seamless integration into epoxy resin systems.
Enables rapid cure kinetics at ambient to moderate elevated temperatures (20–80 °C).
Delivers superior thermal stability and glass transition temperature (Tg) in cured epoxy networks.
Compatible with standard epoxy resins including DGEBA, DGEBF, and novolac epoxies.
High-performance structural adhesives for aerospace and automotive bonding.
Electrical encapsulation and potting compounds requiring low moisture absorption.
Composite matrix resins for carbon fiber reinforced polymer (CFRP) prepregs.
Advanced coating systems for corrosion-resistant industrial linings and tank linings.
Tooling and casting resins demanding dimensional stability and low exotherm.
| Chemical Type | Aliphatic diamine (1,6-hexamethylenediamine) |
| Product Form | 100% molten liquid (no solvent, no additives) |
| Appearance | Clear, colorless to pale yellow liquid |
| Primary Applications | Epoxy resin curing agent for high-Tg, low-moisture, structural systems |
| Key Features | High reactivity, low volatility, excellent stoichiometric control |
| Benefits | Improved mechanical performance, reduced post-cure requirements, enhanced chemical resistance |
| Storage Condition | Store under dry nitrogen, protected from moisture and CO2 |
| Handling Precaution | Use in well-ventilated areas; wear appropriate PPE (gloves, goggles, respirator) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
