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High thermal conductivity for efficient heat dissipation in electronic assemblies.
Excellent electrical insulation properties combined with thermal management capability.
Low compression set and outstanding long-term stability under thermal cycling.
Easy to dispense and cure at room temperature or accelerated with mild heating.
UL 94 V-0 rated for flame retardancy in safety-critical applications.
Thermal interface material (TIM) between power semiconductors and heat sinks.
Encapsulation and potting of LED drivers and automotive power electronics.
Gap-filling compound for battery module thermal management systems.
Die-attach and underfill solutions in high-reliability industrial control units.
Thermal bonding layer in renewable energy inverters and solar power converters.
| Chemical Type | Two-component addition-curing silicone rubber |
| Product Form | Paste (Part A and Part B supplied separately) |
| Appearance | Off-white to light gray, homogeneous paste |
| Primary Applications | Thermal interface materials, encapsulation, and potting |
| Key Features | Thermally conductive, electrically insulating, flame-retardant |
| Shore A Hardness (7 days, 23°C) | 35–45 |
| Thermal Conductivity (ASTM D5470) | 1.8 W/m·K |
| UL Recognition | UL 94 V-0 (1.5 mm thickness) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
