Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Wacker SILRES BS 320 Silicone Resin

Wacker SILRES BS 320 is a solvent-based methyl-phenyl silicone resin from Wacker’s SILRES BS series, offering excellent thermal stability, weather resistance and hardness. It cures via condensation to form durable, hydrophobic coatings ideal for high-performance industrial finishes, release layers and binder applications in composites and coatings.
  • wacker silres bs 320 silicone resin_92cf0507
  • wacker silres bs 320 silicone resin_92cf0507

Features Of Wacker SILRES BS 320 Silicone Resin

  1. High thermal stability, maintaining integrity up to 250 °C continuously.

  2. Excellent weather resistance and UV stability for long-term outdoor performance.

  3. Good compatibility with organic resins (e.g., acrylics, polyesters) enabling hybrid formulations.

  4. Low surface energy providing inherent water repellency and anti-soiling properties.

  5. Solvent-based liquid format ensures easy handling and integration into existing coating lines.

Typical Applications Of Wacker SILRES BS 320 Silicone Resin

  1. High-performance architectural coatings for façades and concrete protection.

  2. Heat-resistant topcoats for industrial metal substrates and exhaust components.

  3. Water-repellent impregnation treatments for natural stone and mineral building materials.

  4. Functional additives in silicone-modified emulsion paints and plasters.

  5. Binders in high-durability roof coatings and elastomeric membranes.

Specifications Of Wacker SILRES BS 320 Silicone Resin

Chemical TypeMethyl-phenyl silicone resin
Product FormLiquid, solvent-based solution
AppearanceClear, colorless to pale yellow liquid
SolventXylene / aromatic hydrocarbon blend
Non-Volatile Content (wt %)50 ± 2 %
Viscosity (25 °C, mPa·s)800 – 1,200
Density (20 °C, g/cm³)0.94 – 0.97
Flash Point (PMCC, °C)Approx. 35


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *