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Highly selective chelating functionality optimized for boron adsorption at near-neutral pH.
Stable polyacrylate matrix ensures excellent chemical resistance and long service life in continuous operation.
Fast kinetics and high capacity enable efficient boron removal down to <0.1 ppm in polishing applications.
Regenerable with mild alkaline solutions (e.g., NaOH), minimizing waste and operational cost.
Low pressure drop and uniform bead size support reliable performance in packed-bed and cartridge systems.
Polishing of ultrapure water (UPW) in semiconductor manufacturing facilities.
Boron control in nuclear power plant primary coolant make-up water.
Treatment of desalinated seawater prior to boiler feed or process use.
Final boron polishing in pharmaceutical-grade water (PW/WFI) production systems.
Recycling and reuse of boron-containing process streams in specialty chemical plants.
| Chemical Type | Polyacrylate-based chelating resin with N-methylglucamine functional groups |
| Product Form | Moist, spherical beads |
| Appearance | Off-white to light tan, uniform granules |
| Particle Size Range | 0.3–1.2 mm |
| Uniformity Coefficient | ≤ 1.6 |
| Moisture Content | 45–55% (as shipped) |
| pH Stability Range | 2–12 (short-term exposure); optimal operation: pH 7–10 |
| Maximum Operating Temperature | 60 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
