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Ultra-low ionic impurity content meeting stringent electronic-grade purity requirements (Na⁺, K⁺, Ca²⁺, Mg²⁺ < 1 ppb each).
Highly uniform spherical morphology with narrow particle size distribution (D₅₀ ≈ 300–400 μm) for consistent polishing performance.
Optimized surface functionality enabling superior chelation and removal of trace metal contaminants from semiconductor process streams.
Excellent chemical stability in acidic and neutral aqueous environments, resistant to oxidative degradation during extended service life.
Low extractables profile validated per SEMI F57 standards, minimizing risk of particle generation or organic leaching in ultrapure water systems.
Final polishing stage in ultrapure water (UPW) production for semiconductor fabrication facilities (fabs).
Polishing loop treatment in advanced lithography tool rinse water recirculation systems.
Trace metal scavenging in photoresist developer reclaim lines.
Critical point-of-use purification for CMP (chemical mechanical planarization) slurry makeup water.
Post-deionization polishing in high-recovery UPW systems requiring sub-ppt metal removal.
| Chemical Type | Chelating polyacrylic acid-based cation exchange resin |
| Product Form | Moist, spherical beads |
| Appearance | Off-white to light amber, translucent spheres |
| Particle Size Range | 250–500 μm (95% by volume) |
| Moisture Content | 48–52% (as shipped) |
| Functional Group Capacity | ≥ 2.8 mmol/mL (H⁺ form, Na⁺ loading test) |
| Maximum Operating Temperature | 60 °C |
| Storage Condition | 5–35 °C, sealed container, avoid freezing and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
