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Ultra-low metallic impurity content (<1 ppb Na, K, Ca, Mg, Fe, Ni, Cu, Zn), meeting stringent SEMI F57 and ASTM D5127 standards for electronic-grade water polishing.
Highly uniform spherical morphology with narrow particle size distribution (600–800 μm), ensuring consistent hydraulic performance and minimal pressure drop in polishing beds.
Optimized functional group density and crosslinking (8% DVB) for superior removal of trace anions (e.g., Cl⁻, SO₄²⁻, NO₃⁻) and silica at sub-ppb levels.
Low total organic carbon (TOC) leachables (<0.5 ppb after full regeneration), minimizing risk of organic contamination in ultrapure water (UPW) systems.
Enhanced chemical stability in aggressive regenerants (e.g., 4–6% NaOH, 4–5% HCl), supporting >1,000 operational cycles without significant capacity loss.
Final polishing stage in ultrapure water (UPW) systems for semiconductor fabrication facilities (fabs).
Polishing loop in photovoltaic (PV) cell manufacturing water treatment lines.
Critical polishing resin in LCD/OLED display panel production UPW networks.
Trace ion removal in high-purity process water for advanced packaging and 3D NAND wafer cleaning.
Guard bed polishing in pharmaceutical-grade water (PW/HPW) systems requiring electronic-grade purity assurance.
| Chemical Type | Strong Base Anion Exchange Resin (Type I, Quaternary Ammonium) |
| Product Form | Moist, spherical beads (supplied in 4% NaOH solution) |
| Appearance | Off-white to light amber, translucent spherical beads |
| Functional Group | Triethylbenzylammonium |
| Crosslinking Degree | 8% divinylbenzene (DVB) |
| Particle Size Range | 600–800 μm (95% retained on 20-mesh sieve) |
| Moisture Content | 45–50% (as shipped) |
| Maximum Operating Temperature | 60 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
