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Highly latent at room temperature—enables extended pot life and excellent storage stability.
Activates rapidly upon heating above 120 °C, delivering efficient epoxy resin curing with low energy input.
Halogen-free formulation, supporting environmentally compliant and RoHS-compliant end products.
Provides excellent mechanical properties and thermal resistance in cured thermoset systems.
Compatible with standard bisphenol-A and novolac epoxy resins without requiring co-catalysts.
Printed circuit board (PCB) laminates and prepregs for high-reliability electronics.
Encapsulants and underfills for semiconductor packaging and advanced IC protection.
Structural adhesives in automotive and aerospace composite bonding applications.
Electrical insulation materials for high-voltage equipment and motor windings.
Thermosetting powder coatings requiring precise melt-and-cure control.
| Chemical Type | Latent amine-based epoxy curing agent |
| Product Form | Powder |
| Appearance | White to off-white free-flowing powder |
| Onset Activation Temperature | Approx. 120 °C (DSC, 10 °C/min) |
| Storage Stability (25 °C) | ≥12 months in sealed container |
| Primary Applications | Epoxy resin systems for electronics, composites, and coatings |
| Key Features | Halogen-free, low volatility, no blooming |
| Benefits | Improved process safety, reduced VOC emissions, consistent cure performance |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
