English
Español
tiếng việt
русский
Low-viscosity polyamine-based curing agent enabling excellent flow and wetting of substrates.
Room-temperature curable system with balanced reactivity—reducing pot life constraints while maintaining practical working time.
Delivers high crosslink density for superior chemical resistance, hardness, and thermal stability in cured epoxy networks.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins without requiring solvents or diluents.
Low volatility and low odor profile, supporting safer handling and improved workplace air quality.
Industrial flooring and heavy-duty concrete coatings requiring abrasion and chemical resistance.
Electrical encapsulation and potting compounds for transformers, busbars, and power electronics.
Adhesives and structural bonding systems in transportation and wind energy components.
Marine and offshore protective coatings for steel infrastructure exposed to saltwater and UV environments.
Composite matrix resins for filament-wound tanks, pipes, and pressure vessels.
| Chemical Type | Polyoxyalkylene polyamine |
| Product Form | Liquid |
| Appearance | Clear to pale yellow liquid |
| Primary Applications | Epoxy coating, adhesive, and composite systems |
| Key Features | Room-temperature cure, low viscosity, high amine hydrogen equivalent weight (AHEW) |
| Benefits | Improved toughness, reduced exotherm, enhanced moisture tolerance during cure |
| Storage Stability | Stable under dry, cool conditions (≤25°C); protect from moisture and freezing |
| Regulatory Compliance | REACH registered; not classified as hazardous per GHS (as supplied) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
