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Fast-curing, low-viscosity aliphatic amine adduct designed for ambient and elevated temperature cure cycles.
Excellent chemical resistance—particularly to alkalis, solvents, and mild acids—after full cure.
Low exotherm profile enables thick-section casting and minimizes thermal stress in sensitive substrates.
Good adhesion to metals, concrete, and composite surfaces without aggressive surface preparation.
Low volatility and reduced odor compared to conventional aliphatic amines, supporting safer handling.
Industrial flooring systems requiring rapid return-to-service and chemical resistance.
Structural adhesive formulations for metal-to-metal and metal-to-composite bonding.
Electrical encapsulation and potting compounds where low heat generation and dimensional stability are critical.
Repair mortars and grouts for concrete infrastructure rehabilitation.
Wind blade bonding and composite tooling matrices demanding consistent cure performance.
| Chemical Type | Aliphatic amine adduct |
| Product Form | Liquid |
| Appearance | Pale yellow to amber, clear liquid |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, and composites |
| Key Features | Ambient-cure capable, low exotherm, low volatility |
| Benefits | Improved worker safety, reduced post-cure requirements, enhanced interfacial adhesion |
| Storage Stability | 12 months at 20–25°C in original sealed container |
| Compatible Resins | Bisphenol-A and bisphenol-F epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
