Low-viscosity, solvent-free polyamine-based curing agent for improved handling and mixing efficiency.
Enables rapid room-temperature cure with excellent mechanical properties and chemical resistance.
Offers superior adhesion to metals, composites, and concrete substrates.
Low exotherm profile supports thick-section casting and minimizes thermal stress.
Meets UL 94 V-0 flammability requirements when formulated in appropriate epoxy systems.
Structural adhesives for aerospace and transportation bonding.
Electrical encapsulants and potting compounds for power electronics.
High-performance coatings for industrial flooring and protective linings.
Composite matrix resins in wind blade and marine applications.
Tooling and mold-making compounds requiring dimensional stability and low shrinkage.
| Chemical Type | Polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, homogeneous liquid |
| Primary Applications | Structural adhesives, encapsulants, coatings, composites |
| Key Features | Room-temperature cure, low viscosity, low exotherm, UL 94 V-0 capable |
| Benefits | Improved processability, enhanced interfacial adhesion, reduced post-cure requirements |
| Storage Stability | 12 months at 25°C in original unopened container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China