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Low-viscosity liquid formulation enabling easy handling and precise metering in automated dispensing systems.
Fast ambient-cure capability with excellent through-cure performance on epoxy resins, even at low temperatures (down to 10°C).
Superior chemical resistance—particularly to alkalis, solvents, and moisture—after full cure.
Low exotherm profile minimizes thermal stress and warpage in thick-section or thermally sensitive composites.
Non-blushing chemistry ensures consistent surface appearance and reliable adhesion in humid environments.
Structural adhesive formulations for aerospace composite bonding and repair.
High-performance potting and encapsulation of electronic components and power modules.
Wind turbine blade root joints and spar cap bonding in renewable energy applications.
Industrial flooring and heavy-duty protective coatings requiring rapid return-to-service.
Tooling and mold-making compounds where dimensional stability and low shrinkage are critical.
| Chemical Type | Modified aliphatic amine |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Primary Applications | Epoxy resin curing agent for structural adhesives, potting, and composite bonding |
| Key Features | Ambient-curing, low viscosity, non-blushing, low exotherm |
| Benefits | Improved process efficiency, enhanced durability, reduced post-cure requirements |
| Storage Stability | At least 12 months in original unopened container at 25°C |
| Compatibility | Designed for use with standard DGEBA and novolac epoxy resins |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
