Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Allnex BECKOPOX EP 2350w 60WA Epoxy Resin

Allnex BECKOPOX EP 2350w 60WA is a waterborne epoxy resin designed for high-performance industrial coatings. It offers excellent chemical resistance, adhesion to metals and concrete, and low VOC content. Ideal for can coatings, coil coatings, and protective linings, this eco-friendly resin enables durable, cross-linked films with balanced flexibility and hardness.
  • allnex beckopox ep 2350w 60wa epoxy resin_abbc8f35
  • allnex beckopox ep 2350w 60wa epoxy resin_abbc8f35

Features Of Allnex BECKOPOX EP 2350w 60WA Epoxy Resin

  1. Waterborne epoxy dispersion offering low VOC and reduced environmental impact.

  2. Excellent compatibility with amine hardeners for robust crosslinking in ambient or heat-cured systems.

  3. Good hydrolytic stability and storage stability at room temperature (up to 12 months).

  4. High film hardness and chemical resistance after full cure, suitable for demanding protective coatings.

  5. Optimized rheology for spray and dip application without excessive thixotropy or sagging.

Typical Applications Of Allnex BECKOPOX EP 2350w 60WA Epoxy Resin

  1. Industrial maintenance coatings for steel structures and infrastructure.

  2. Water-based two-component epoxy primers for automotive underbody and chassis protection.

  3. Interior architectural coatings requiring low odor and compliance with indoor air quality standards.

  4. Coatings for metal packaging and food-contact compatible can linings (when formulated and approved per regulatory requirements).

  5. Electrical insulation varnishes for motors and transformers in environmentally sensitive production facilities.

Specifications Of Allnex BECKOPOX EP 2350w 60WA Epoxy Resin

Chemical TypeWaterborne bisphenol-A based epoxy dispersion
Product FormLiquid dispersion
AppearanceOpaque white to off-white liquid
Non-Volatile Content (wt%)60 ± 2 %
pH (at 25°C)7.0 – 8.5
Viscosity (mPa·s, Brookfield RVT, #3 spindle, 20 rpm)300 – 800
Particle Size (D50)0.3 – 0.8 µm
Minimum Film Formation Temperature (MFFT)≤ 10 °C


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