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High reactivity with epoxy resins enabling rapid room-temperature cure.
Excellent chemical resistance post-cure, particularly to solvents and weak acids.
Low viscosity for easy handling, precise metering, and homogeneous mixing.
Good adhesion to metals, composites, and cured epoxy substrates.
Low volatility and non-hazardous classification under GHS for safe industrial handling.
Structural adhesives for automotive bonding and assembly.
Electrical encapsulation and potting compounds in power electronics.
Composite matrix systems for wind turbine blade manufacturing.
Repair mortars and high-performance flooring systems.
Tooling and mold-making materials requiring dimensional stability.
| Chemical Type | Amine-based aliphatic curing agent |
| Product Form | Liquid |
| Appearance | Clear, pale yellow liquid |
| Density (20 °C) | 0.92–0.94 g/cm³ |
| Viscosity (25 °C) | 180–220 mPa·s |
| Amine Value | 390–410 mg KOH/g |
| Primary Applications | Epoxy resin curing for structural adhesives and composites |
| Storage Stability | ≥12 months at 15–25 °C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
