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High reactivity with epoxy resins, enabling rapid cure at ambient or slightly elevated temperatures.
Excellent chemical resistance post-cure, particularly against solvents, alkalis, and mild acids.
Low viscosity for easy handling, metering, and homogeneous blending with epoxy systems.
Good shelf stability when stored under recommended conditions (dry, cool, sealed).
Produces rigid, high-glass-transition-temperature (Tg) thermoset networks with superior mechanical strength.
Structural adhesives for automotive and transportation assembly.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance coatings for industrial flooring and corrosion protection.
Composite matrix resins in wind turbine blade and aerospace tooling applications.
Repair mortars and grouts requiring fast turnaround and early load-bearing capability.
| Chemical Type | Aromatic amine-based curing agent |
| Product Form | Liquid |
| Appearance | Pale yellow to amber clear liquid |
| Density (20 °C) | Approx. 1.08–1.12 g/cm³ |
| Viscosity (25 °C) | Approx. 300–600 mPa·s |
| Amine Value | Approx. 420–460 mg KOH/g |
| Primary Applications | Epoxy resin curing for structural adhesives, coatings, and composites |
| Key Features | Fast ambient cure, high Tg, low volatility, good compatibility with standard DGEBA resins |
Q1: What is the primary function of BASF HI 190B/S in epoxy systems?
A: BASF HI 190B/S is a latent, amine-based curing agent designed to provide controlled reactivity and extended pot life in one-component epoxy formulations, enabling stable storage at ambient temperature and rapid crosslinking upon thermal activation.
Q2: At what temperature range does HI 190B/S typically initiate curing?
A: Curing onset generally begins above 120 °C, with full network development achieved within typical industrial bake cycles between 140 °C and 180 °C — exact profile depends on formulation, film thickness, and heating rate.
Q3: Is HI 190B/S compatible with standard epoxy resins such as DGEBA types?
A: Yes, HI 190B/S is broadly compatible with conventional liquid and solid bisphenol-A and bisphenol-F based epoxy resins, as well as many modified epoxy systems, though compatibility and cure performance should be verified experimentally for each specific formulation.
Q4: How is dosage typically determined for HI 190B/S?
A: Dosage is formulation-dependent and generally ranges from 0.1% to 2% by weight relative to total epoxy solids, with optimal levels determined through rheological monitoring, DSC analysis, and final property evaluation — it is not recommended to use fixed ratios without validation.
Q5: Does HI 190B/S require special handling or storage conditions?
A: It should be stored in tightly sealed containers under dry, cool conditions (below 25 °C) and protected from moisture and ambient amines; prolonged exposure to humidity or elevated temperatures may reduce latency and shelf life.
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