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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Low viscosity (8,000–12,000 cP at 25 °C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good adhesion to metals, glass, and composite substrates without primer requirement.
Electrical potting and encapsulation of transformers, reactors, and power electronics modules.
Structural bonding in aerospace and automotive composites requiring thermal stability and dimensional integrity.
High-voltage insulators and bushings for utility and renewable energy systems.
Castings for industrial tooling, jigs, and precision fixtures demanding low shrinkage and high hardness.
Matrix resin in filament-wound pressure vessels and fiber-reinforced pipes.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Homogeneous, transparent, free of gels or particulates |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25 °C) | 9,500–11,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25 °C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
