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Fast-reacting aliphatic amine-based curing agent enabling rapid gelation and short demolding cycles.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Low viscosity for easy metering, mixing, and impregnation into fiber reinforcements.
Good flexibility retention in cured systems without sacrificing mechanical strength.
Low volatility and reduced amine odor compared to conventional DETA-type hardeners.
Structural adhesives for automotive and transportation assembly.
Electrical encapsulants and potting compounds for power electronics.
Composite matrix resins for filament-wound pressure vessels and pultruded profiles.
High-performance flooring and industrial coating systems requiring fast turnaround.
Repair mortars and grouts for concrete infrastructure rehabilitation.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow transparent liquid |
| Specific Gravity (25°C) | 0.92–0.96 g/cm³ |
| Viscosity (25°C) | 150–300 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity (with DGEBA, 80°C) | Gel time: 8–15 minutes |
| Storage Stability | 12 months at <25°C in sealed original container |
Q1: What is the primary function of FUJICURE FXR-1081 in epoxy systems?
A: FUJICURE FXR-1081 is a latent, amine-based curing agent designed to provide controlled reactivity and extended pot life at ambient temperatures, while enabling rapid, high-temperature cure to achieve excellent thermal and mechanical performance in thermoset epoxy formulations.
Q2: Is FXR-1081 suitable for one-component (1K) epoxy applications?
A: Yes — FXR-1081 is specifically engineered for use in one-component epoxy systems where latency, storage stability, and precise thermal activation are required, such as in powder coatings, pre-impregnated composites (prepregs), and heat-curable adhesives.
Q3: How does FXR-1081 compare to traditional dicyandiamide (DICY) in terms of processing and performance?
A: FXR-1081 offers improved solubility in common epoxy resins and more consistent dispersion compared to DICY, resulting in reduced risk of bloom and enhanced batch-to-batch reproducibility. Its activation profile also allows for greater flexibility in cure schedule tuning without sacrificing final crosslink density.
Q4: What are typical handling and storage recommendations for FXR-1081?
A: Store in original sealed containers under cool, dry conditions, away from moisture and direct sunlight. Prolonged exposure to humidity or elevated temperatures may reduce latency and shelf life. Always follow standard industrial hygiene practices when handling fine organic powders.
Q5: Can FXR-1081 be used with bisphenol-F or novolac-type epoxy resins?
A: Yes — FXR-1081 demonstrates broad compatibility with various epoxy resin types, including bisphenol-A, bisphenol-F, and phenolic novolacs, making it suitable for demanding applications requiring high Tg, chemical resistance, or electrical insulation properties.
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