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Low-viscosity liquid epoxy resin enabling excellent processability and ease of handling in ambient-temperature mixing and dispensing operations.
High purity with low chloride content, supporting superior electrical insulation properties and long-term reliability in electronic encapsulation.
Excellent compatibility with standard amine and anhydride curing agents, facilitating broad formulation flexibility for thermoset systems.
Good adhesion to metals, ceramics, and composite substrates without requiring aggressive surface pretreatment.
Consistent batch-to-batch performance ensured by Dow’s rigorous manufacturing controls and quality assurance protocols.
Encapsulation and potting of electronic components including transformers, sensors, and power modules.
Electrical insulation coatings for motor windings, busbars, and high-voltage connectors.
Structural adhesives for aerospace and automotive composites where thermal stability and bond integrity are critical.
Matrix resin in filament-wound pressure vessels and corrosion-resistant piping systems.
Formulation base for high-performance flooring and protective coatings in industrial environments.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electronic encapsulation, electrical insulation, structural adhesives, composite matrices |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
