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Ultra-fast cure at low temperatures (as low as –20 °C), enabling assembly in cold environments without oven heating.
Two-component, solvent-free silicone adhesive system with balanced pot life and rapid handling strength development.
Excellent adhesion to low-surface-energy substrates including polyolefins, fluoropolymers, and coated metals without priming.
Outstanding long-term durability under thermal cycling (–55 °C to +150 °C) and high humidity exposure.
Low modulus formulation provides stress relief for delicate or dissimilar material bonds, reducing delamination risk.
Automotive sensor bonding (e.g., radar modules, LiDAR housings) requiring cold-weather production line compatibility.
Medical device assembly of sterilizable components where low-temperature processing preserves heat-sensitive electronics and polymers.
Aerospace interior trim bonding where rapid fixture strength and vibration resistance are critical.
Electronics encapsulation and conformal coating anchoring on PCBs exposed to wide ambient temperature swings.
Industrial IoT enclosure sealing for outdoor edge devices operating in sub-zero climates.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component kit (Part A: base; Part B: catalyst); supplied in dual-chamber cartridges or bulk pails |
| Appearance | Part A: translucent off-white paste; Part B: translucent pale yellow paste |
| Mix Ratio (by weight) | 10:1 (A:B) |
| Typical Pot Life (23 °C) | 60–90 minutes after mixing |
| Cure Schedule (Typical) | 15 min at –20 °C / 5 min at 23 °C / 2 min at 60 °C for handling strength |
| Primary Applications | Structural bonding, sealing, and gasketing of temperature-sensitive assemblies |
| Regulatory Compliance | Meets ISO 10993-5 (cytotoxicity) and USP Class VI requirements; RoHS 2015/863 compliant |
| Common Compatible Systems | Suitability |
| Dow DOWSIL™ Primer-1205 | Highly Recommended – Enhances adhesion to glass, stainless steel, and anodized aluminum |
| Dow DOWSIL™ Dispensing Equipment (e.g., MPM 4000 series) | Highly Recommended – Optimized for 10:1 volumetric metering and cold-temperature dispensing |
| Standard industrial UV-curable primers (non-silicone) | Suitable – May be used on select plastics when approved by joint design validation |
| Conventional epoxy-based dispensing systems | Not Recommended – Incompatible with platinum catalyst; risk of inhibition and incomplete cure |
Q1: What is the CAS Registry Number for Dow DOWSIL EA-6052?
A: Part A: 68441-17-8; Part B: 138278-28-5. Full formulation details are available under NDA upon request via Dow’s technical service portal.
Q2: What is the recommended minimum bond line thickness and maximum gap-fill capability?
A: Minimum recommended bond line thickness is 0.1 mm; maximum reliable gap fill is 3.0 mm under standard dispensing conditions and substrate confinement.
Q3: How does EA-6052 compare to DOWSIL™ EA-6020 in terms of low-temperature performance and inhibition sensitivity?
A: EA-6052 features enhanced low-temperature kinetics and reduced sensitivity to common inhibitors (e.g., sulfur, amines, latex residues) versus EA-6020, making it more robust for high-mix manufacturing environments.
Q4: Are extractables or leachables data available for medical applications?
A: Yes — full USP <661.1>/<661.2> extractables profiling (aqueous, 50% ethanol, and hexane extraction at 50 °C for 72 h) is documented in the Biocompatibility Dossier (BIO-DS-EA6052-01), accessible under confidentiality agreement.
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E-mail: wangxingqiang@ericwchem.com
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