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Non-slump, thixotropic formulation enables precise, sag-free application in vertical and overhead assemblies.
Fast room-temperature cure with low exotherm—ideal for heat-sensitive electronic components.
Excellent adhesion to common substrates including plastics, metals, and printed circuit board laminates without primer.
UL 94 V-0 rated flame retardancy for enhanced safety in demanding electrical environments.
Stable performance across wide operating temperature range (–55 °C to +200 °C).
Encapsulation of power electronics modules and IGBTs in electric vehicle inverters.
Protection of high-voltage sensors and battery management system (BMS) components.
Conformal encapsulation of LED drivers and lighting control units.
Moisture and vibration protection for industrial automation controllers and motor drives.
Dielectric isolation and thermal interface enhancement in renewable energy power converters.
| Chemical Type | Condensation-cure silicone elastomer |
| Product Form | Two-component (Part A + Part B), paste-like |
| Appearance | Off-white to light gray, uniform paste |
| Primary Applications | Electrical encapsulation, potting, and protective coating |
| Key Features | Non-slump, UL 94 V-0, low exotherm, room-temperature cure |
| Shore A Hardness (7 days @ 23 °C) | 35–45 |
| Density (g/cm³) | 1.6–1.8 |
| Operating Temperature Range | –55 °C to +200 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
