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High-performance silicone-based adhesive offering excellent adhesion to low-surface-energy substrates including polyolefins and fluoropolymers.
One-component, moisture-curing formulation enabling simple, solvent-free processing without mixing or refrigeration.
Outstanding resistance to thermal cycling, UV exposure, and humidity over extended service life.
Low modulus elastomeric bond that accommodates thermal expansion mismatch between dissimilar materials.
UL 94 HB flammability rating and RoHS-compliant formulation for regulated electronics and automotive applications.
Sealing and bonding of LED lighting housings and optical components.
Attachment of sensors, displays, and control panels in automotive interior modules.
Encapsulation and mounting of flexible printed circuits (FPCs) in wearable electronics.
Structural bonding of plastic trim parts in consumer appliances and white goods.
Die-attach and housing assembly for industrial IoT devices requiring environmental durability.
| Chemical Type | Acetoxy-cure silicone elastomer |
| Product Form | Paste, thixotropic, medium-viscosity |
| Appearance | Opaque white to off-white |
| Primary Applications | Adhesion, sealing, and gasketing of plastics, metals, and glass |
| Key Features | Room-temperature cure, low shrinkage, non-corrosive |
| Benefits | Reduced assembly time, no primer required on most substrates, long shelf life (12 months at 25°C) |
| Cure Mechanism | Moisture-cured (surface-to-core) |
| Storage Conditions | 25°C or below, in original unopened container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
