Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 1740 A/B Silicone

Dow DOWSIL SE 1740 A/B is a two-part addition-cure liquid silicone rubber from Dow’s DOWSIL™ portfolio offering excellent flowability low viscosity and rapid room-temperature curing. Ideal for precision molding encapsulation and medical device manufacturing it delivers high biocompatibility thermal stability and consistent mechanical properties after cure.
  • dow dowsil se 1740 a b silicone_2d080b56
  • dow dowsil se 1740 a b silicone_2d080b56

Features Of Dow DOWSIL SE 1740 A/B Silicone

  1. Two-part, addition-cure liquid silicone rubber system offering excellent flow and self-leveling properties.

  2. Low viscosity before cure enables easy dispensing and precise filling of complex geometries.

  3. High thermal stability with continuous service temperature up to 180 °C after full cure.

  4. Excellent electrical insulation properties and low dielectric loss across wide frequency ranges.

  5. UL 94 V-0 rated for flame resistance, supporting stringent safety requirements in electronic applications.

Typical Applications Of Dow DOWSIL SE 1740 A/B Silicone

  1. Encapsulation and potting of power electronics, including IGBT modules and EV inverters.

  2. Thermal interface material (TIM) bonding and gap-filling in high-power LED assemblies.

  3. Insulating coatings for automotive sensors and battery management system (BMS) components.

  4. Sealing and protection of industrial control units exposed to harsh thermal and environmental conditions.

  5. Underfill and conformal coating for miniaturized circuit boards in aerospace and defense systems.

Specifications Of Dow DOWSIL SE 1740 A/B Silicone

Chemical TypePlatinum-catalyzed addition-cure silicone elastomer
Product FormTwo-component liquid (Part A and Part B)
AppearancePart A: Clear to light amber viscous liquid; Part B: Clear to light amber liquid
Primary ApplicationsEncapsulation, potting, thermal management, and electrical insulation
Key FeaturesSelf-leveling, low shrinkage, high adhesion to common substrates
BenefitsImproved reliability under thermal cycling, reduced processing time vs. condensation-cure systems
Cure MechanismAddition cure (no by-products)
Storage Stability12 months at ≤25 °C in unopened containers


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