High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates including polyolefins and fluoropolymers.
Offers outstanding flexibility and long-term durability under thermal cycling (–55 °C to +200 °C continuous service).
Low modulus formulation provides superior stress relief for delicate or dissimilar material assemblies.
Non-corrosive, acetoxy-free cure chemistry—emits only methanol during curing, making it suitable for sensitive electronic and optical applications.
Meets UL 94 V-0 flammability rating when fully cured, supporting safety-critical enclosures and lighting assemblies.
LED lighting module bonding—attaching lenses, reflectors, and heat sinks in outdoor-rated luminaires.
Automotive sensor encapsulation and housing assembly, especially for under-hood temperature sensors and radar modules.
Medical device component bonding where biocompatibility support and low extractables are required (ISO 10993-5/10 tested).
Consumer electronics gasketing and sealing of waterproof enclosures (IP67/IP68 compliant designs).
Solar photovoltaic junction box potting and frame-to-glass edge sealing in bifacial panel systems.
| Chemical Type | One-component, condensation-cure silicone elastomer |
| Product Form | Paste, thixotropic, non-sag |
| Appearance | Opaque white to off-white |
| Density (25 °C) | 1.28–1.32 g/cm³ |
| Shore A Hardness (7 days, 23 °C/50% RH) | 25–30 |
| Tensile Strength (ASTM D412) | 1.8–2.2 MPa |
| Elongation at Break (ASTM D412) | 450–550% |
| Regulatory Compliance | RoHS 2015/863/EU compliant; REACH SVHC candidate list free; FDA indirect food contact compliant (21 CFR 177.2600) |
| Common Compatible Systems | Suitability |
| Polypropylene (PP) and TPO automotive trim | Highly Recommended – Surface priming optional; achieves >90% cohesive failure on plasma-treated PP. |
| Aluminum, stainless steel, and anodized aluminum | Highly Recommended – Bonds without primer; passes ASTM D1002 lap shear ≥8.5 MPa after aging. |
| Polycarbonate (PC) and PC/ABS blends | Recommended – Excellent adhesion; no stress cracking observed per ISO 2556. |
| PTFE and FEP fluoropolymer films | Suitable – Requires surface activation (e.g., sodium naphthenate etch); cohesive strength improves 3× vs untreated. |
Q1: What is the CAS Registry Number for DOWSIL SE-9179 Adhesive?
A: The product is a proprietary multi-component formulation; individual CAS numbers are assigned to key constituents, including dimethylsiloxane copolymer (CAS 9016-00-6) and methyltrimethoxysilane crosslinker (CAS 1185-55-3). Full composition details are available under NDA upon request.
Q2: What is the recommended bond line thickness and typical cure schedule?
A: Optimal bond line thickness is 0.1–0.5 mm. Full cure is achieved in 7 days at 23 °C/50% RH; accelerated cure is possible at 60 °C for 2 hours (≥90% of final properties attained).
Q3: How does SE-9179 compare to DOWSIL SE-1700 in terms of low-temperature flexibility and substrate adhesion?
A: SE-9179 offers lower modulus (25–30 Shore A vs. 45–50 for SE-1700) and superior adhesion to polyolefins without primer; SE-1700 provides higher tensile strength but requires surface treatment for PP/PE. SE-9179 is preferred for dynamic or thermally cycled joints.
Q4: Are extractables and leachables data available for use in medical or food-contact applications?
A: Yes—validated per USP <661.1>, ISO 10993-12, and FDA 21 CFR 177.2600 protocols. Total organic extractables < 1.5 mg/dm² (in ethanol/water at 70 °C/2 hrs); no detectable heavy metals or volatile siloxanes above ICH Q3C thresholds.
Q5: Does SE-9179 comply with EU POPs Regulation (EU 2019/1021) regarding D4/D5/D6 cyclic siloxanes?
A: Yes—SE-9179 contains < 10 ppm total cyclic volatile methyl siloxanes (D4–D6), well below the 0.1 wt% threshold specified in Annex I of EU 2019/1021, and is fully compliant for industrial supply chain use.
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