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High-performance, two-part addition-cure silicone elastomer offering excellent thermal stability and low compression set.
Exceptional electrical insulation properties with low dielectric loss and high volume resistivity.
Good adhesion to common substrates including metals, plastics, and cured silicone without primer.
Low viscosity in mixed state enables easy dispensing, potting, and encapsulation of delicate electronic components.
UL 94 V-0 rated for flame resistance, supporting safety-critical applications in demanding environments.
Encapsulation and protection of power electronics, including IGBT modules and EV inverters.
Potting of high-voltage transformers and busbar assemblies in renewable energy systems.
Thermal interface and stress-relief material for LED lighting drivers and power supplies.
Sealing and bonding in aerospace avionics housings requiring wide temperature range performance.
Insulating encapsulant for medical device sensors and implantable-grade electronics (non-implantable use).
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance | Part A: Transparent to translucent viscous liquid; Part B: Translucent liquid |
| Base Polymer | Dimethyl/methylvinyl siloxane copolymer |
| Cure Mechanism | Room temperature or elevated temperature addition cure |
| Shore A Hardness (7 days, 23°C) | 45–55 |
| Tensile Strength (ASTM D412) | ≥8.0 MPa |
| Volume Resistivity (ASTM D257) | ≥1.0 × 10¹⁵ Ω·cm |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
