Two-part, platinum-catalyzed silicone elastomer system offering excellent flexibility and tear resistance.
Low viscosity before cure enables easy mixing, degassing, and casting into intricate molds.
Room temperature or elevated temperature curing with tunable pot life and rapid demold time.
Outstanding thermal stability across –65 °C to +200 °C continuous service range.
Biocompatibility compliant with USP Class VI and ISO 10993-5 standards for medical device applications.
Medical device prototyping and low-volume production of implantable and external components.
Encapsulation and potting of sensitive electronics in aerospace and automotive sensors.
Soft robotics actuators and wearable haptic interfaces requiring high elasticity and fatigue resistance.
Microfluidic device fabrication and lab-on-a-chip bonding/sealing layers.
Optical component molding for LED encapsulation and light-diffusing lenses.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component liquid kit (Part A: base polymer; Part B: catalyst) |
| Appearance | Part A: translucent, low-viscosity liquid; Part B: translucent, low-viscosity liquid |
| Mix Ratio (by weight) | 10:1 (A:B) |
| Cure Conditions | RT cure: 24–48 hrs; Accelerated cure: 60 °C for 2–4 hrs |
| Shore A Hardness (ASTM D2240) | 50 ± 5 |
| Tensile Strength (ASTM D412) | ~7 MPa |
| Elongation at Break (ASTM D412) | ~120% |
Q1: What is the typical mixing ratio of Part A to Part B?
A: Dow SYLGARD 182 is supplied as a two-part addition-cure silicone elastomer system with a 10:1 weight ratio of base (Part A) to curing agent (Part B). Accurate weighing and thorough mixing are essential for optimal cure performance and mechanical properties.
Q2: Can SYLGARD 182 be cured at room temperature, or is elevated temperature required?
A: SYLGARD 182 can cure at room temperature, but full physical property development typically requires post-cure at elevated temperatures (e.g., 60–80 °C for several hours). Higher cure temperatures accelerate crosslinking and improve thermal stability, tensile strength, and elongation.
Q3: Is SYLGARD 182 suitable for encapsulation of sensitive electronic components?
A: Yes — SYLGARD 182 is widely used for potting and encapsulation in electronics due to its low modulus, excellent dielectric properties, thermal stability, and minimal exotherm during cure. Its low shrinkage and adhesion to common substrates help mitigate stress on delicate components.
Q4: How should unmixed SYLGARD 182 components be stored to maintain shelf life?
A: Store both Part A and Part B in tightly sealed containers at cool, dry conditions (typically below 25 °C), away from moisture, direct sunlight, and sources of platinum catalyst contamination (e.g., sulfur-, nitrogen-, or phosphorus-containing compounds). Under proper storage, shelf life is generally 12 months from date of manufacture.
Q5: Does SYLGARD 182 require a primer for adhesion to challenging substrates like polyethylene or polypropylene?
A: Adhesion to low-surface-energy plastics such as polyethylene or polypropylene is inherently limited. While surface treatments (e.g., plasma or corona) may improve bonding, a dedicated silicone primer is often recommended for reliable long-term adhesion in demanding applications.
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