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Two-part, platinum-catalyzed silicone elastomer system offering excellent flexibility and elongation.
Low viscosity before cure enables easy mixing, degassing, and casting into intricate molds.
Room temperature or elevated temperature curing with tunable pot life and rapid gelation.
Outstanding thermal stability, maintaining performance from –55 °C to +200 °C.
Biocompatibility tested per ISO 10993–5 and USP Class VI, suitable for medical device prototyping.
Encapsulation and potting of sensitive electronic components and sensors.
Microfluidic device fabrication and soft lithography (e.g., PDMS stamping).
Prototyping of biomedical devices, including wearable sensors and implantable test articles.
Optical bonding and light-diffusing elements in LED and display applications.
Flexible mold making for low-volume production of polyurethane, epoxy, or wax parts.
| Chemical Type | Platinum-cured polydimethylsiloxane (PDMS) |
| Product Form | Two-component liquid kit (Part A: base; Part B: catalyst) |
| Appearance | Clear, colorless to pale yellow viscous liquids |
| Mix Ratio (by weight) | 10:1 (Base : Catalyst) |
| Shore A Hardness (7 days @ 25 °C) | 50 ± 5 |
| Elongation at Break (ASTM D412) | ≥ 120% |
| Tensile Strength (ASTM D412) | ≥ 4.0 MPa |
| Primary Applications | Encapsulation, soft lithography, biomedical prototyping, optical interfaces |
Q1: What is the typical mixing ratio of Part A to Part B?
A: Dow SYLGARD 184 is supplied as a two-part system with a standard 10:1 weight ratio of base (Part A) to curing agent (Part B). Accurate weighing and thorough mixing are essential to ensure complete crosslinking and optimal elastomeric properties.
Q2: How does cure time vary with temperature?
A: Cure time is highly temperature-dependent. At room temperature (23–25 °C), full cure typically requires 24–72 hours. Elevated temperatures—such as 60–80 °C—can significantly accelerate the process, achieving full cure in several hours. Post-curing at elevated temperature may further enhance thermal stability and mechanical performance.
Q3: Can SYLGARD 184 be used for encapsulation of sensitive electronic components?
A: Yes, SYLGARD 184 is widely used for electronic encapsulation and potting due to its excellent electrical insulation, low modulus, thermal stability, and ability to conform to complex geometries without generating excessive exotherm or stress during cure.
Q4: Is SYLGARD 184 compatible with common mold materials?
A: SYLGARD 184 exhibits good release characteristics from many non-porous mold surfaces, including polished metals, glass, and certain cured silicone rubbers. For best results with intricate molds or repeated use, application of a suitable release agent is recommended.
Q5: Does SYLGARD 184 require degassing before curing?
A: Degassing under vacuum is strongly recommended after mixing to remove entrapped air bubbles—especially for applications requiring optical clarity, void-free encapsulation, or precise dimensional fidelity. This step helps prevent defects and ensures uniform material performance.
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E-mail: wangxingqiang@ericwchem.com
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