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High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Soft, conformable silicone elastomer formulation enabling low-stress interface with sensitive components.
Excellent long-term reliability under thermal cycling and humidity exposure per industry-standard JEDEC conditions.
Non-silicone-oil bleeding design to prevent contamination of optical surfaces and adjacent electronics.
Room-temperature curable with optional heat-accelerated cure, supporting flexible manufacturing integration.
Thermal interface material (TIM) for power modules in electric vehicle inverters and onboard chargers.
Heat transfer pad between IGBTs, MOSFETs, and heatsinks in industrial motor drives and renewable energy converters.
Conformal thermal coupling for high-power LED arrays in automotive lighting and outdoor signage.
Die-attach alternative for thermally sensitive sensors and RF power amplifiers in 5G infrastructure equipment.
Gap-filling solution for irregular or warped surfaces in battery management system (BMS) control boards.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-part liquid (Part A + Part B), mix ratio 1:1 by weight |
| Appearance | Opaque gray paste (Part A), translucent gray paste (Part B) |
| Primary Applications | Thermal interface material (TIM) for power electronics and LED systems |
| Key Features | Thermally conductive, electrically insulating, low modulus, non-corrosive |
| Shore A Hardness (7 days, 25°C) | 25–30 |
| Density (25°C) | 2.0–2.2 g/cm³ |
| UL Recognition | UL 94 V-0 (thickness ≥0.5 mm) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
