Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Ancamide 506 Amidoamine Curing Agent

Evonik Ancamide 506 is a high-performance amidoamine curing agent from the Ancamide® series, designed for epoxy resin systems requiring fast ambient-cure, excellent flexibility, and superior adhesion to damp or contaminated substrates—ideal for industrial coatings, adhesives, and composites.
  • evonik ancamide 506 amidoamine curing agent_b7903379
  • evonik ancamide 506 amidoamine curing agent_b7903379

Features Of Evonik Ancamide 506 Amidoamine Curing Agent

  1. Low-viscosity liquid amidoamine offering excellent reactivity with epoxy resins at ambient and elevated temperatures.

  2. Provides superior flexibility and impact resistance in cured epoxy systems without compromising chemical resistance.

  3. Enables extended pot life while maintaining rapid cure development, supporting efficient processing in industrial applications.

  4. Compatible with standard epoxy resins including DGEBA and modified epoxies, facilitating broad formulation versatility.

  5. Free of volatile organic compounds (VOCs) and meets common regulatory requirements for industrial coatings and adhesives.

Typical Applications Of Evonik Ancamide 506 Amidoamine Curing Agent

  1. Structural adhesives for automotive and aerospace assembly.

  2. High-performance protective coatings for industrial steel and concrete substrates.

  3. Electrical encapsulation and potting compounds requiring thermal stability and dielectric integrity.

  4. Flooring systems including self-leveling and mortar-based epoxy flooring.

  5. Composite matrix resins for wind energy and transportation components.

Specifications Of Evonik Ancamide 506 Amidoamine Curing Agent

Chemical TypeAmidoamine
Product FormLiquid
AppearancePale yellow to amber clear liquid
Amine Value320–360 mg KOH/g
Viscosity (25 °C)200–400 mPa·s
Density (20 °C)0.94–0.98 g/cm³
Reactivity ProfileAmbient-cure capable; accelerated cure at 40–80 °C
Primary ApplicationsEpoxy adhesives, coatings, composites, and encapsulants


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