Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Dynacoll S506.01 Copolyester Resin

Evonik Dynacoll S506.01 is a high-performance copolyester resin from the Dynacoll series, engineered for reactive hot-melt adhesives. It offers excellent thermal stability, fast setting, strong adhesion to polar substrates, and good flexibility. Widely used in automotive, packaging, and hygiene applications requiring durable, low-viscosity bonding solutions.
  • evonik dynacoll s506.01 copolyester resin_687f1614
  • evonik dynacoll s506.01 copolyester resin_687f1614

Features Of Evonik Dynacoll S506.01 Copolyester Resin

  1. High thermal stability with excellent melt viscosity control for consistent processing.

  2. Outstanding adhesion to polar substrates including PET, PA, and aluminum foil.

  3. Low extractables and excellent compatibility with food-contact compliant formulations.

  4. Good flexibility and toughness at low temperatures without sacrificing tensile strength.

  5. Designed for solvent-free hot-melt applications requiring rapid setting and high bond integrity.

Typical Applications Of Evonik Dynacoll S506.01 Copolyester Resin

  1. Flexible packaging laminates for retortable and microwaveable pouches.

  2. High-performance hot-melt adhesives for automotive interior trim bonding.

  3. Multi-layer coextrusion adhesive layers in barrier film structures.

  4. Specialty labels requiring resistance to plasticizers and low-temperature flexibility.

  5. Medical device packaging where sterilization stability and biocompatibility are critical.

Specifications Of Evonik Dynacoll S506.01 Copolyester Resin

Chemical TypeAliphatic-aromatic copolyester
Product FormPellets
AppearanceOff-white to light beige, semi-crystalline granules
Melt Flow Rate (MFR, 230 °C/2.16 kg)25–35 g/10 min
Softening Point (Vicat, 50 N)85–92 °C
Density (23 °C)1.18–1.22 g/cm³
Moisture Content (as received)< 0.15 wt%
Primary ApplicationsHot-melt adhesive component for flexible packaging and technical laminates


Evonik Dynacoll S506.01 Copolyester Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary function of Dynacoll S506.01 in hot melt adhesive formulations?

A: Dynacoll S506.01 is a reactive copolyester resin designed to enhance cohesion, heat resistance, and open time in reactive hot melt adhesives—particularly those based on polyurethane prepolymers. It contributes to improved green strength and thermal stability without compromising processability.


Q2: Is Dynacoll S506.01 compatible with common polyurethane-based reactive hot melts?

A: Yes, Dynacoll S506.01 is specifically engineered for compatibility with aliphatic and aromatic polyurethane prepolymers. It disperses homogeneously upon melting and supports crosslinking development during post-application curing.


Q3: How does Dynacoll S506.01 affect processing temperature and viscosity?

A: This copolyester resin typically lowers the overall melt viscosity of reactive systems at application temperatures (e.g., 120–160 °C), improving pumpability and sprayability. Its softening behavior supports extended open time while maintaining sufficient tack and early grab.


Q4: What are recommended handling and storage conditions?

A: Store in original sealed packaging at temperatures below 30 °C, protected from moisture and direct sunlight. Avoid prolonged exposure to ambient humidity prior to use, as this resin may absorb trace moisture that could affect reactivity in sensitive PU systems.



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