Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Dynacoll S506.01 Copolyester Resin

Evonik Dynacoll S506.01 is a high-performance copolyester resin from the Dynacoll series, engineered for reactive hot-melt adhesives. It offers excellent thermal stability, fast setting, strong adhesion to polar substrates, and good flexibility. Widely used in automotive, packaging, and hygiene applications requiring durable, low-viscosity bonding solutions.
  • evonik dynacoll s506.01 copolyester resin_687f1614
  • evonik dynacoll s506.01 copolyester resin_687f1614

Features Of Evonik Dynacoll S506.01 Copolyester Resin

  1. High thermal stability with excellent melt viscosity control for consistent processing.

  2. Outstanding adhesion to polar substrates including PET, PA, and aluminum foil.

  3. Low extractables and excellent compatibility with food-contact compliant formulations.

  4. Good flexibility and toughness at low temperatures without sacrificing tensile strength.

  5. Designed for solvent-free hot-melt applications requiring rapid setting and high bond integrity.

Typical Applications Of Evonik Dynacoll S506.01 Copolyester Resin

  1. Flexible packaging laminates for retortable and microwaveable pouches.

  2. High-performance hot-melt adhesives for automotive interior trim bonding.

  3. Multi-layer coextrusion adhesive layers in barrier film structures.

  4. Specialty labels requiring resistance to plasticizers and low-temperature flexibility.

  5. Medical device packaging where sterilization stability and biocompatibility are critical.

Specifications Of Evonik Dynacoll S506.01 Copolyester Resin

Chemical TypeAliphatic-aromatic copolyester
Product FormPellets
AppearanceOff-white to light beige, semi-crystalline granules
Melt Flow Rate (MFR, 230 °C/2.16 kg)25–35 g/10 min
Softening Point (Vicat, 50 N)85–92 °C
Density (23 °C)1.18–1.22 g/cm³
Moisture Content (as received)< 0.15 wt%
Primary ApplicationsHot-melt adhesive component for flexible packaging and technical laminates


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