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Fast-reacting aliphatic amine-based curing agent for room-temperature and elevated-temperature epoxy systems.
Enables excellent mechanical properties including high tensile strength and impact resistance in cured epoxy networks.
Low viscosity (≈350–450 mPa·s at 25 °C) ensures easy handling, precise metering, and superior wetting of fillers and reinforcements.
Low volatility and low skin sensitization potential compared to conventional DETA-type amines — supports safer industrial handling.
Provides good chemical resistance to water, salts, and mild acids after full cure.
High-performance structural adhesives for automotive and aerospace bonding.
Electrical encapsulation and potting compounds requiring rapid throughput and reliable dielectric performance.
Industrial flooring and heavy-duty coatings demanding rapid return-to-service and abrasion resistance.
Composite matrix resins for pultrusion and filament winding processes.
Repair mortars and grouts where fast strength development and low odor are critical.
| Chemical Type | Aliphatic polyamine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow liquid |
| Density (20 °C) | ≈0.92–0.96 g/cm³ |
| Viscosity (25 °C) | 350–450 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Reactivity Profile | Medium-fast, compatible with standard DGEBA resins |
| Primary Applications | Structural adhesives, coatings, composites, electrical encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
