High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without requiring aggressive surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and vacuum infusion.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good chemical resistance to alkalis, diluted acids, and common solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage bushings.
Structural adhesive formulations for aerospace composite bonding and repair.
Matrix resin in filament-wound pressure vessels and fiber-reinforced pipes.
Casting and potting compounds for power electronics and renewable energy inverters.
Tooling and mold-making resins for carbon fiber composite production.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid, amber-transparent |
| Appearance | Clear, low-viscosity liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Color (Gardner) | ≤3 |
| Chloride Content | ≤500 ppm |
| Primary Applications | High-performance electrical insulation & structural composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China