High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and efficient impregnation.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after full curing with standard amine hardeners.
Low chloride content (< 800 ppm), ensuring enhanced corrosion resistance in protective coatings.
Electrical insulation systems for transformers, bushings, and encapsulated components.
Structural adhesives in aerospace and automotive composite bonding.
High-performance protective coatings for marine and offshore infrastructure.
Matrix resin for fiber-reinforced plastics (FRP) used in wind turbine blades and pressure vessels.
Potting and encapsulation of sensitive electronic modules requiring dielectric integrity and moisture resistance.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at 20–25°C in sealed original containers |
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E-mail: wangxingqiang@ericwchem.com
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