English
Español
tiếng việt
русский
High purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent thermal stability and low volatility, supporting safe handling and processing at elevated temperatures.
Superior adhesion to metals, glass, and composite substrates without requiring surface primers.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy mixing, degassing, and impregnation in demanding formulations.
Reactive functionality optimized for compatibility with standard amine and anhydride curing agents.
Electrical insulation systems for medium-voltage power transformers and bushings.
Structural adhesive formulations in aerospace and automotive composites manufacturing.
Encapsulation and potting compounds for high-reliability electronic modules and sensors.
Wind turbine blade bonding and root-end structural reinforcement systems.
High-performance coatings for corrosion protection in offshore and chemical processing equipment.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid, free of gels or sediment |
| Epoxide Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Key Features | High reactivity, low ionic impurities, excellent hydrolytic stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
