Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel AQUENCE GL33-060L Hot Melt Adhesive

Henkel AQUENCE GL33-060L is a high-performance hot melt adhesive designed for automotive interior bonding. It offers excellent heat resistance, low VOC emissions, and strong adhesion to diverse substrates like PP, PET, and coated fabrics. This eco-friendly, solvent-free adhesive enables fast setting, consistent dispensing, and reliable long-term durability in demanding OEM applications.
  • henkel aquence gl33 060l hot melt adhesive_65ce5e5c
  • henkel aquence gl33 060l hot melt adhesive_65ce5e5c

Features Of Henkel AQUENCE GL33-060L Hot Melt Adhesive

  1. High-speed bonding performance suitable for high-volume automated assembly lines.

  2. Excellent heat resistance up to 120 °C continuous service temperature.

  3. Low odor and low VOC formulation compliant with stringent industrial hygiene standards.

  4. Optimized open time and set speed balance for precise part alignment and rapid handling.

  5. Good adhesion to diverse substrates including PP, PE, ABS, and painted metals.

Typical Applications Of Henkel AQUENCE GL33-060L Hot Melt Adhesive

  1. Automotive interior trim assembly (e.g., door panels, dashboards, headliners).

  2. White goods appliance bonding (e.g., control panels, insulation layers, decorative overlays).

  3. Consumer electronics housing assembly (e.g., speaker grilles, bezels, battery covers).

  4. Medical device component bonding requiring cleanroom-compatible hot melt technology.

  5. Industrial filtration module assembly with non-woven and thermoplastic materials.

Specifications Of Henkel AQUENCE GL33-060L Hot Melt Adhesive

Chemical TypePolyolefin-based thermoplastic hot melt adhesive
Product FormGranules (free-flowing, uniform size)
AppearanceLight amber, semi-crystalline granules
Primary ApplicationsStructural and semi-structural bonding in automotive and durable goods
Key FeaturesHigh cohesive strength, thermal stability, substrate versatility
BenefitsReduced energy consumption vs. solvent-based alternatives; no curing required
Recommended Application Temperature150–170 °C
Storage ConditionsStore in original sealed packaging at 15–25 °C; protect from humidity


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