Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Henkel TECHNOMELT 2206 Hot Melt Adhesive

Henkel TECHNOMELT 2206 is a high-performance polyamide-based hot melt adhesive offering excellent heat resistance, strong adhesion to metals and plastics, and rapid setting. Ideal for demanding industrial bonding—especially in automotive and appliance assembly—where durability under thermal stress is critical. It delivers consistent flow, low odor, and reliable performance across automated application systems.
  • henkel technomelt 2206 hot melt adhesive_93add584
  • henkel technomelt 2206 hot melt adhesive_93add584

Features Of Henkel TECHNOMELT 2206 Hot Melt Adhesive

  1. High initial tack and excellent green strength for rapid handling in high-speed packaging lines.

  2. Optimized thermal stability for consistent performance across extended melt times and variable processing temperatures.

  3. Low odor and low volatile organic compound (VOC) emission, supporting indoor air quality and workplace safety compliance.

  4. Excellent adhesion to low-surface-energy substrates including polypropylene (PP), polyethylene (PE), and coated cardboard.

  5. Good heat resistance up to 70 °C under short-term load, maintaining bond integrity in ambient and moderately elevated conditions.

Typical Applications Of Henkel TECHNOMELT 2206 Hot Melt Adhesive

  1. Case and carton sealing in food and beverage packaging.

  2. Label attachment for rigid plastic and laminated paperboard containers.

  3. Assembly of hygiene product packaging, including diaper and feminine care outer wrappers.

  4. Bookbinding and graphic arts applications requiring clean remelting and minimal stringing.

  5. Non-woven lamination in medical and protective apparel manufacturing.

Specifications Of Henkel TECHNOMELT 2206 Hot Melt Adhesive

Chemical TypeEthylene-vinyl acetate (EVA) based thermoplastic hot melt
Product FormGranules
AppearanceOff-white to light yellow, free-flowing granules
Softening Point (Ring & Ball)85–90 °C
Melt Viscosity (at 180 °C)2,500–3,500 mPa·s
Open Time4–8 seconds (at 180 °C, standard substrate)
Primary ApplicationsPackaging assembly, labeling, bookbinding, non-woven bonding
Key FeaturesHigh tack, low odor, excellent substrate versatility, good thermal stability


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