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Low-viscosity liquid formulation enabling excellent mixing and processing with epoxy resins.
Enhanced thermal stability and extended pot life compared to conventional aromatic amine hardeners.
Improved compatibility with bisphenol-A, bisphenol-F, and novolac epoxy systems.
Reduced volatility and lower skin sensitization potential versus unmodified m-phenylenediamine (m-PDA).
Delivers high glass transition temperature (Tg) and superior chemical resistance in cured networks.
High-performance structural adhesives for aerospace and automotive composites.
Electrical encapsulation and potting compounds requiring UL 94 V-0 rating.
Heavy-duty industrial floor coatings and chemical-resistant tank linings.
Wind turbine blade bonding and repair systems demanding elevated Tg and toughness.
Advanced composite tooling matrices for autoclave and out-of-autoclave manufacturing.
| Chemical Type | Modified aromatic amine (alkylated m-phenylenediamine derivative) |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, free from sediment or haze |
| Viscosity (25°C) | 180–250 mPa·s |
| Amine Value | 380–420 mg KOH/g |
| Density (25°C) | 1.08–1.12 g/cm³ |
| Reactivity with DGEBA | Exothermic peak at 115–125°C (DSC, 10°C/min) |
| Primary Applications | Epoxy resin curing for high-Tg, chemically resistant, and structural applications |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
