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Fast-acting solvent-based cleaner specifically formulated to dissolve cured and uncured hot melt adhesives at elevated temperatures.
Non-corrosive to common metal components in adhesive application equipment, including stainless steel, brass, and aluminum.
Low-residue formulation minimizes re-deposition and reduces post-cleaning maintenance downtime.
Compatible with automated cleaning systems and manual dip or brush application methods.
Designed for safe use in industrial environments when handled according to recommended PPE and ventilation guidelines.
Removal of residual hot melt adhesive from spray nozzles and glue guns in packaging line equipment.
Cleaning of metering pumps, gear pumps, and manifold systems in continuous adhesive dispensing operations.
Maintenance of rotary applicators and slot-coating heads used in nonwovens and hygiene product manufacturing.
Declogging of heated hoses and static mixers in automotive trim and assembly bonding lines.
Preventive cleaning of adhesive reservoirs and feed tanks during scheduled production changeovers.
| Chemical Type | Solvent blend (aromatic-free, low-VOC) |
| Product Form | Liquid |
| Appearance | Clear, pale amber liquid |
| Primary Applications | Hot melt adhesive removal from industrial dispensing equipment |
| Key Features | Heat-activated cleaning, non-corrosive, low foaming |
| Benefits | Reduced equipment downtime, extended component life, improved adhesive consistency |
| Recommended Operating Temperature | 60–100 °C (for optimal performance) |
| Storage Conditions | Store in original container below 30 °C, away from direct sunlight and ignition sources |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
