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Highly efficient latent curing agent for epoxy resins with excellent storage stability at room temperature.
Enables low-temperature curing (100–130 °C) without compromising final mechanical or thermal performance.
Low volatility and minimal odor, supporting safer handling and improved workplace hygiene.
Compatible with a broad range of standard and modified epoxy resins, including liquid and solid types.
Delivers superior interlaminar shear strength and glass transition temperature (Tg) in cured composites.
Aerospace composite prepregs requiring precise cure control and high Tg.
Electronics encapsulants and underfill materials for fine-pitch flip-chip packaging.
Wind turbine blade adhesives and structural bonding films.
Automotive carbon fiber reinforced polymer (CFRP) components with demanding thermal cycling resistance.
High-performance tooling and mold-making compounds for rapid prototyping.
| Chemical Type | Imidazole derivative (2-phenyl-4-methylimidazole modified) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing granular solid |
| Melting Point | 118–122 °C (DSC, heating rate 10 °C/min) |
| Assay (by HPLC) | ≥ 98.5% |
| Moisture Content | ≤ 0.2% (Karl Fischer titration) |
| Primary Applications | Epoxy resin curing for advanced composites and electronics |
| Key Features | Latent, low-odor, low-temperature curable, high-Tg promoter |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
