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High reactivity with standard bisphenol-A and bisphenol-F epoxy resins at ambient to moderate elevated temperatures.
Excellent chemical resistance post-cure, including resistance to alkalis, solvents, and mild acids.
Low viscosity formulation enables easy handling, precise metering, and improved wetting of fillers and reinforcements.
Provides superior mechanical strength and thermal stability in cured epoxy systems.
Low volatility and low odor profile support safer industrial processing and compliance with VOC-reduction initiatives.
Structural adhesives for automotive and aerospace assembly.
Electrical encapsulation and potting compounds for power electronics and LED modules.
High-performance coatings for industrial flooring and corrosion-resistant linings.
Composite matrix resins for wind turbine blades and carbon fiber reinforced parts.
Electrical insulation systems in transformers and high-voltage equipment.
| Chemical Type | Aromatic amine-based curing agent |
| Product Form | Liquid |
| Appearance | Clear to pale yellow transparent liquid |
| Primary Applications | Structural adhesives, electrical encapsulation, protective coatings, composites |
| Key Features | Fast cure kinetics, low viscosity, high Tg capability, low volatility |
| Benefits | Improved process efficiency, enhanced final part durability, reduced energy consumption during curing |
| Storage Stability | At least 12 months at 5–25°C in original sealed container |
| Handling Precaution | Use in well-ventilated areas; avoid skin contact and inhalation of mists |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
