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Highly flexible aliphatic polyamide chemistry for improved impact resistance and toughness.
Low viscosity enables excellent wetting of fillers, fibers, and substrates.
Extended pot life at ambient temperatures for improved processing window in large-part fabrication.
Good adhesion to metals, concrete, and composite substrates without surface priming.
Low exotherm during cure minimizes thermal stress and warpage in thick-section castings.
Structural adhesive formulations for automotive and transportation assemblies.
Electrical encapsulants and potting compounds for power electronics and transformers.
Industrial flooring and protective coatings requiring chemical and abrasion resistance.
Composite repair systems for wind turbine blades and marine structures.
Concrete repair mortars and anchoring systems in construction applications.
| Chemical Type | Aliphatic polyamide |
| Product Form | Liquid |
| Appearance | Amber to brown viscous liquid |
| Primary Applications | Epoxy resin curing agent for adhesives, coatings, and composites |
| Key Features | Low viscosity, ambient-cure capability, flexible cured film |
| Benefits | Improved toughness, extended working time, excellent substrate adhesion |
| Storage Stability | 12 months at 20–25°C in unopened original container |
| Compatibility | Standard bisphenol-A and bisphenol-F epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
