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Low-viscosity liquid polyamide solution enabling easy handling and uniform mixing with epoxy resins.
Excellent flexibility and impact resistance in cured epoxy systems, even at low temperatures.
Good chemical resistance to alkalis, solvents, and mild acids in protective coating formulations.
Reduced amine blush tendency compared to conventional polyamide curing agents.
Compatible with standard bisphenol-A and bisphenol-F epoxy resins for ambient-cure applications.
Industrial maintenance coatings for steel structures and pipelines.
Concrete floor coatings requiring abrasion resistance and chemical durability.
Marine anti-corrosive primers and topcoats for offshore and shipyard use.
Electrical insulation systems in transformers and cast components.
Adhesives and potting compounds for electrical and electronic assemblies.
| Chemical Type | Polyamide adduct solution |
| Product Form | Liquid |
| Appearance | Amber to brown transparent liquid |
| Primary Applications | Ambient-cure epoxy coatings, adhesives, and potting compounds |
| Key Features | Low viscosity, flexible cure, reduced amine blush |
| Benefits | Improved workability, enhanced toughness, reliable performance in humid conditions |
| Storage Stability | At least 12 months in original sealed container at 20–25 °C |
| Recommended Mix Ratio (by weight) | Typically 100 parts epoxy resin : 35–50 parts Aradur 450 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
