Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Epoxy Curing Agent Ancamine 2405

Evonik Ancamine® 2405 is a high-performance aliphatic amine epoxy curing agent from the Ancamine® series, offering rapid room-temperature cure, excellent flexibility, low viscosity, and superior chemical resistance—ideal for coatings, adhesives, and composites demanding toughness and durability.
  • evonik epoxy curing agent ancamine 2405_186c08e1
  • evonik epoxy curing agent ancamine 2405_186c08e1

Features Of Evonik Epoxy Curing Agent Ancamine 2405

  1. Low-viscosity polyetheramine-based curing agent enabling excellent flow and wetting of substrates.

  2. Provides fast ambient-cure reactivity with good pot life for efficient processing in industrial applications.

  3. Delivers superior flexibility and impact resistance in cured epoxy systems without sacrificing chemical resistance.

  4. Offers low volatility and low odor, supporting safer handling and compliance with industrial hygiene standards.

  5. Compatible with standard DGEBA and modified epoxy resins for broad formulation versatility.

Typical Applications Of Evonik Epoxy Curing Agent Ancamine 2405

  1. High-performance protective coatings for steel and concrete infrastructure.

  2. Electrical encapsulation and potting compounds requiring thermal stability and dielectric integrity.

  3. Adhesives and structural bonding systems in transportation and wind energy sectors.

  4. Composite matrix resins for filament-wound and pultruded components.

  5. Repair mortars and high-build flooring systems demanding rapid return-to-service.

Specifications Of Evonik Epoxy Curing Agent Ancamine 2405

Chemical TypePolyetheramine (tertiary amine-terminated)
Product FormLiquid
AppearanceClear, pale yellow liquid
Primary ApplicationsCoatings, adhesives, composites, encapsulation
Key FeaturesAmbient-curing, flexible, low volatility, low odor
BenefitsImproved toughness, extended pot life, enhanced substrate adhesion
Storage Stability12 months unopened at 20–25 °C
Reactivity ProfileFast ambient cure with moderate exotherm


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