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Latent reactivity enables extended pot life at ambient temperatures, supporting efficient processing and handling.
Activates rapidly upon thermal trigger (typically >120 °C), delivering fast and consistent epoxy crosslinking.
Halogen-free formulation meets stringent environmental and regulatory requirements for electronics and aerospace applications.
Excellent compatibility with standard DGEBA and novolac epoxy resins without phase separation or viscosity instability.
Yields cured systems with high glass transition temperature (Tg), superior thermal stability, and low dielectric loss.
High-reliability encapsulants and underfills for semiconductor packaging and flip-chip assemblies.
Prepregs and composite matrices in aerospace structural components requiring low outgassing and high Tg.
Electrically insulating adhesives and bonding pastes for power electronics modules and EV battery assemblies.
Thermal interface materials (TIMs) where controlled cure kinetics and minimal volatile content are critical.
| Chemical Type | Dicyandiamide (DICY)-based latent accelerator system |
| Product Form | Free-flowing white to off-white crystalline powder |
| Appearance | Crystalline solid, free of visible impurities |
| Primary Applications | Epoxy-based encapsulants, adhesives, laminates, and prepregs |
| Key Features | Latent, halogen-free, thermally activated, low volatility |
| Recommended Cure Schedule | 150–180 °C for 30–90 minutes (varies by resin system) |
| Storage Conditions | Store sealed under dry conditions at ≤25 °C; protect from moisture |
| Shelf Life | 12 months from date of manufacture when stored properly |
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E-mail: wangxingqiang@ericwchem.com
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