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Low-viscosity polyamide curing agent enabling excellent flow and wetting in epoxy systems.
Provides balanced pot life and rapid ambient-cure performance for efficient production cycles.
Delivers high flexibility and impact resistance in cured epoxy coatings and adhesives.
Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Non-chlorinated formulation supporting safer handling and regulatory compliance.
Industrial maintenance coatings for steel and concrete substrates.
Structural adhesives in transportation and wind energy components.
Electrical encapsulation and potting compounds requiring toughness and dielectric stability.
Flooring systems including self-leveling and decorative epoxy terrazzo.
Marine and offshore protective coatings exposed to humid and saline environments.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Ambient amber to light brown viscous liquid |
| Primary Applications | Epoxy coatings, adhesives, and flooring systems |
| Key Features | Ambient-curing, low viscosity, flexible cure |
| Benefits | Improved substrate wetting, reduced mixing energy, enhanced impact resistance |
| Recommended Epoxy Resin Ratio (parts by weight) | 100 : 35–45 (epoxy : Aradur 424XW 50) |
| Storage Conditions | Store in original sealed container at 15–25°C; protect from moisture |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
