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Zero ozone depletion potential (ODP = 0) and low global warming potential (GWP < 15), supporting sustainable manufacturing compliance.
Non-flammable under standard operating conditions, classified as NFPA 704 Health 1, Flammability 0, Reactivity 0.
Exceptional thermal and chemical stability, resistant to hydrolysis and oxidation across wide pH and temperature ranges.
Low surface tension and high volatility enable rapid, residue-free drying in precision cleaning applications.
Compatible with common elastomers (Viton®, EPDM, silicone) and metals, minimizing compatibility testing burden.
Aerospace component cleaning — removal of fluxes, oils, and particulates from avionics and turbine assemblies.
Semiconductor manufacturing — post-etch and pre-bonding solvent rinse for MEMS and advanced packaging substrates.
Medical device reprocessing — non-aqueous final rinse for implant-grade stainless steel and polymer components.
Optical lens and sensor cleaning — particle-free drying without haze or micro-residue on coated surfaces.
High-voltage electronics degreasing — dielectric fluid for cleaning insulators, busbars, and power module substrates.
| Chemical Type | Branched hydrofluoroether (HFE), C6F14O isomer mixture |
| Product Form | Clear, colorless liquid |
| Appearance | Transparent, odorless liquid with slight ether-like note |
| Boiling Point (1 atm) | ~86–89 °C |
| Melting Point | < –100 °C |
| Density (20 °C) | 1.34–1.37 g/cm³ |
| Dielectric Strength (2.5 mm gap) | >40 kV/cm |
| Regulatory Compliance | REACH registered; compliant with EU RoHS 3 (2015/863); no SVHCs above threshold |
| Common Compatible Systems | Suitability |
| Vapor degreasing equipment (e.g., P-Solv®, ZEISS CleanLine) | Highly Recommended – Optimized for open-top and enclosed cold-wall vapor degreasers with minimal retrofitting |
| Ultrasonic cleaning systems (40–80 kHz) | Recommended – Requires temperature control (< 45 °C) to maintain stability and avoid cavitation-induced decomposition |
| Batch spray-in-air cleaners | Suitable – Effective for targeted rinsing; compatible with stainless-steel manifolds and polymeric nozzles |
| Automated precision washers (e.g., Buehler MetPrep®, KYZEN AQUA) | Recommended – Integrates seamlessly into multi-stage aqueous/HFE hybrid processes |
Q1: What is the CAS Registry Number for Hydrofluoroether Series CL7200?
A: The CAS number is 132182-03-9 (representative isomer composition; full mixture registration available upon request under confidentiality agreement).
Q2: What is the recommended usage concentration when blended with co-solvents?
A: CL7200 is typically used neat (100%) in vapor degreasing and precision rinse applications; when blended (e.g., with alcohols for enhanced solvency), recommended ratios are 70–90% CL7200 / 10–30% co-solvent by volume.
Q3: How does CL7200 compare to HFC-43-10mee or traditional chlorinated solvents in terms of material compatibility and safety?
A: Unlike HFC-43-10mee (which exhibits higher GWP and lower thermal stability), CL7200 offers superior oxidative resistance and lower environmental impact; versus chlorinated solvents (e.g., TCE, nPB), it eliminates toxicity concerns (no hepatotoxicity or neurotoxicity signals) and requires no special ventilation beyond standard industrial hygiene practices.
Q4: Is CL7200 subject to migration or leaching in medical device polymer housings during cleaning cycles?
A: Extensive extractables and leachables (E&L) studies per USP <87>/<88> and ISO 10993-12 confirm negligible migration (< 0.1 ppm) in polycarbonate, PEEK, and medical-grade silicones after standard 3-minute immersion at 25 °C.
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E-mail: wangxingqiang@ericwchem.com
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