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Excellent flexibility and impact resistance in cured epoxy systems.
Low viscosity enables easy handling, mixing, and improved wetting of fillers and reinforcements.
Good compatibility with standard liquid and solid bisphenol-A epoxy resins.
Room-temperature curable with extended pot life for practical processing windows.
Superior chemical resistance to alkalis, salts, and mild solvents after full cure.
Protective coatings for steel structures in marine and industrial environments.
Adhesives for bonding metals, composites, and concrete substrates.
Electrical encapsulants and insulating compounds for low-voltage components.
Flooring systems requiring toughness, abrasion resistance, and moderate chemical exposure tolerance.
Repair mortars and grouts for infrastructure maintenance applications.
| Chemical Type | Polyamide-based curing agent |
| Product Form | Liquid |
| Appearance | Amber to light brown transparent liquid |
| Viscosity (25°C) | 3,000–5,000 mPa·s |
| Amine Value | 220–260 mg KOH/g |
| Reactivity | Room temperature cure; gel time ~4–6 hours at 25°C (with DGEBA resin) |
| Primary Applications | Coatings, adhesives, encapsulants, repair mortars |
| Storage Stability | 12 months in original sealed container at 15–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
