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High-performance bisphenol-F-based epoxy resin offering superior chemical resistance and thermal stability.
Low viscosity formulation enabling excellent flow, wetting, and ease of processing in casting and impregnation applications.
Excellent electrical insulation properties with low dielectric loss and high volume resistivity.
Enhanced adhesion to metals, composites, and ceramic substrates without requiring aggressive surface pretreatment.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
High-voltage electrical insulation systems including bushings, insulators, and transformer components.
Structural encapsulation and potting of sensitive electronic modules and power electronics.
Advanced composite matrix resin for aerospace and wind turbine blade manufacturing.
High-reliability adhesive formulations for bonding dissimilar substrates in industrial equipment.
Castable systems for precision tooling, jigs, and wear-resistant industrial linings.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 12,000–15,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Key Features | Low viscosity, high purity, excellent electrical insulation, thermal stability up to 180°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
