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High reactivity with standard amine and anhydride curing agents, enabling rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (450–650 mPa·s at 25°C) for easy handling, degassing, and deep impregnation into fiber reinforcements.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1×10¹⁴ Ω·cm).
Good thermal stability with glass transition temperature (Tg) of 120–130°C after full cure with DDS.
Electrical encapsulation and potting of power modules, sensors, and high-voltage components.
Matrix resin for filament-wound pressure vessels and structural composite parts in aerospace and energy sectors.
Insulating varnish and impregnating resin for high-efficiency motors and generators.
Adhesive formulation for bonding dissimilar substrates in automotive electronics and battery modules.
Base resin for high-performance printed circuit board (PCB) laminates and prepregs.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 450–650 mPa·s |
| Chloride Content | < 900 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed containers |
Q1: What is the primary function of Shikoku C11Z in epoxy formulations?
A: Shikoku C11Z is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is Shikoku C11Z suitable for high-gloss, low-VOC coatings applications?
A: Yes — due to its low volatility and reactive nature, C11Z supports formulating high-solids and low-VOC epoxy coating systems while maintaining good film formation, surface appearance, and chemical resistance.
Q3: How does C11Z compare to conventional glycidyl ether diluents in terms of reactivity with amine hardeners?
A: C11Z exhibits moderate reactivity — slightly lower than mono-functional aliphatic glycidyl ethers but higher than many aromatic or cycloaliphatic diluents — enabling balanced pot life and cure speed in ambient- or elevated-temperature curing systems.
Q4: Can Shikoku C11Z be used in adhesives requiring high peel strength and flexibility?
A: Yes — when incorporated at appropriate levels, C11Z helps tailor the flexibility and toughness of cured epoxy networks, supporting improved peel and impact resistance in structural and engineering adhesive formulations.
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