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High reactivity with standard amine and anhydride curing agents, enabling rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (450–650 mPa·s at 25°C) for easy handling, degassing, and deep impregnation into fiber reinforcements.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1×10¹⁴ Ω·cm).
Good thermal stability with glass transition temperature (Tg) of 120–130°C after full cure with DDS.
Electrical encapsulation and potting of power modules, sensors, and high-voltage components.
Matrix resin for filament-wound pressure vessels and structural composite parts in aerospace and energy sectors.
Insulating varnish and impregnating resin for high-efficiency motors and generators.
Adhesive formulation for bonding dissimilar substrates in automotive electronics and battery modules.
Base resin for high-performance printed circuit board (PCB) laminates and prepregs.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 450–650 mPa·s |
| Chloride Content | < 900 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
