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High thermal stability with continuous service temperature up to 180 °C.
Excellent electrical insulation properties, ideal for high-voltage encapsulation.
Low viscosity (12,000–15,000 cP at 25 °C) enabling superior flow and void-free impregnation.
Halogen-free formulation meeting RoHS and REACH compliance requirements.
Optimized reactivity profile for controlled gel time and extended pot life in automated dispensing systems.
Encapsulation of power electronics, including IGBT modules and EV inverters.
Impregnation of stators, rotors, and transformers in industrial motors and generators.
Structural bonding and potting of aerospace-grade sensors and avionics components.
Dielectric coating for high-frequency RF and microwave substrates.
| Chemical Type | Bisphenol-F based epoxy resin |
| Product Form | Clear, amber liquid |
| Appearance | Homogeneous, low-viscosity liquid, free from gels or sediment |
| Primary Applications | Electrical encapsulation, impregnation, and high-performance potting |
| Key Features | Halogen-free, high Tg, low shrinkage, excellent adhesion to metals and composites |
| Benefits | Enhanced long-term reliability under thermal cycling and humidity stress |
| Storage Conditions | Store at 15–25 °C in sealed containers; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
