Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion EPIKOTE 235 Liquid Epoxy Resin

Hexion EPIKOTE 235 is a low-viscosity liquid epoxy resin in the EPIKOTE™ series, designed for coatings, adhesives, and composites. It offers excellent chemical resistance, adhesion, and mechanical properties with fast cure response. Widely used in industrial maintenance, marine, and protective applications due to its reliable performance and formulation flexibility.
  • hexion epikote 235 liquid epoxy resin_b8f6c66b
  • hexion epikote 235 liquid epoxy resin_b8f6c66b

Features Of Hexion EPIKOTE 235 Liquid Epoxy Resin

  1. Low-viscosity liquid epoxy resin enabling excellent flow, wetting, and ease of processing in ambient or elevated temperature cure systems.

  2. High purity with low chlorine content, supporting superior electrical insulation properties and long-term reliability in demanding applications.

  3. Excellent compatibility with standard amine, anhydride, and catalytic hardeners for versatile formulation flexibility.

  4. Good hydrolytic stability and resistance to moisture ingress during storage and handling.

  5. Consistent batch-to-batch performance ensured by Hexion’s stringent manufacturing controls and quality assurance protocols.

Typical Applications Of Hexion EPIKOTE 235 Liquid Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.

  2. Structural adhesives for aerospace, automotive, and wind energy composite bonding.

  3. Matrix resin in filament-wound pipes, tanks, and pressure vessels for corrosion-resistant infrastructure.

  4. Coatings and linings for chemical process equipment requiring chemical and thermal resistance.

  5. Prepregs and infusion resins for carbon fiber and glass fiber reinforced composites.

Specifications Of Hexion EPIKOTE 235 Liquid Epoxy Resin

Chemical TypeBisphenol-A based diglycidyl ether epoxy resin
Product FormClear to pale yellow low-viscosity liquid
AppearanceTransparent, slightly viscous liquid at 25°C
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity at 25°C12,000–16,000 cP
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsEncapsulation, composites, adhesives, coatings, and electrical insulation


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