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Low-viscosity liquid epoxy resin enabling excellent flow, wetting, and ease of processing in ambient or elevated temperature cure systems.
High purity with low chlorine content, supporting superior electrical insulation properties and long-term reliability in demanding applications.
Excellent compatibility with standard amine, anhydride, and catalytic hardeners for versatile formulation flexibility.
Good hydrolytic stability and resistance to moisture ingress during storage and handling.
Consistent batch-to-batch performance ensured by Hexion’s stringent manufacturing controls and quality assurance protocols.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace, automotive, and wind energy composite bonding.
Matrix resin in filament-wound pipes, tanks, and pressure vessels for corrosion-resistant infrastructure.
Coatings and linings for chemical process equipment requiring chemical and thermal resistance.
Prepregs and infusion resins for carbon fiber and glass fiber reinforced composites.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, composites, adhesives, coatings, and electrical insulation |
Q1: What is the primary chemical classification and typical functionality of EPIKOTE 235?
A: EPIKOTE 235 is a liquid bisphenol-A based diglycidyl ether epoxy resin with an average functionality close to 2. It is characterized by low viscosity, good reactivity with common amine and anhydride hardeners, and consistent molecular weight distribution suitable for formulating high-performance coatings, adhesives, and composites.
Q2: Is EPIKOTE 235 compatible with standard epoxy curing agents, and what are key handling considerations?
A: Yes, EPIKOTE 235 is broadly compatible with aliphatic and cycloaliphatic amines, polyamides, and anhydrides. Due to its low volatility and moderate reactivity, it offers extended pot life in many formulations. Store in tightly sealed containers at room temperature, away from moisture and strong oxidizing agents; avoid prolonged exposure to elevated temperatures prior to use.
Q3: How does EPIKOTE 235 compare to solid epoxy resins like EPIKOTE 1001 or 1004 in terms of processing advantages?
A: As a liquid resin, EPIKOTE 235 eliminates the need for melting or high-temperature pre-dissolution steps required for solid grades. This simplifies mixing, improves homogeneity with additives and fillers, reduces energy input during formulation, and enables ambient- or low-temperature processing in certain coating and encapsulation applications.
Q4: Can EPIKOTE 235 be used in food-contact or pharmaceutical-related applications?
A: EPIKOTE 235 is not specifically certified for direct food-contact applications. Its suitability for such uses depends entirely on final formulated system compliance, end-use conditions, and regulatory evaluation by the responsible party. Customers intending such applications should consult Hexion’s regulatory support team and conduct full migration and safety assessments as required.
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