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Low-viscosity liquid formulation enabling excellent mixing and processing with standard epoxy resins.
Fast-reacting amine-based chemistry delivering short gel times and efficient room-temperature cure profiles.
High reactivity with bisphenol-A and bisphenol-F epoxy resins, ensuring robust crosslink density and mechanical performance.
Good chemical resistance post-cure, particularly to alkalis, solvents, and mild acids.
Low volatility and minimal amine odor, supporting safer handling in enclosed manufacturing environments.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
Structural adhesives used in automotive and aerospace composite bonding.
Coating systems for corrosion-resistant industrial flooring and tank linings.
High-performance composites in wind turbine blade bonding and repair formulations.
Electronic underfill and conformal coating applications requiring rapid throughput.
| Chemical Type | Aromatic amine adduct |
| Product Form | Liquid |
| Appearance | Clear to pale yellow, homogeneous liquid |
| Specific Gravity (25°C) | 1.02–1.06 g/cm³ |
| Viscosity (25°C) | 200–400 mPa·s |
| Amine Value | 280–320 mg KOH/g |
| Reactive Hydrogen Equivalent Weight (HEW) | 95–105 g/eq |
| Shelf Life (unopened, 25°C) | 12 months |
Q1: What is the primary chemical class of H-113K?
A: H-113K is a modified aliphatic amine-based epoxy curing agent, engineered to offer balanced reactivity, low volatility, and reduced skin sensitization potential compared to conventional unmodified amines.
Q2: Is H-113K suitable for ambient-cure epoxy systems?
A: Yes — H-113K is specifically formulated for ambient- or moderate-temperature cure applications, delivering good pot life and reliable crosslinking without forced heating, making it well-suited for coatings, adhesives, and repair mortars.
Q3: How does H-113K compare to standard DETA or TETA in terms of handling safety?
A: H-113K exhibits significantly lower vapor pressure and reduced dermal irritation potential versus traditional aliphatic amines like DETA or TETA, supporting safer industrial handling — though appropriate PPE and ventilation remain essential per workplace safety protocols.
Q4: What types of epoxy resins is H-113K typically compatible with?
A: H-113K demonstrates broad compatibility with standard liquid and solid bisphenol-A and bisphenol-F epoxy resins, as well as many novolac and cycloaliphatic epoxies — formulation optimization is recommended to achieve desired gel time, hardness development, and chemical resistance.
Q5: What is the typical dosage range for H-113K in epoxy formulations?
A: Dosage depends on resin type, target performance, and processing conditions, but H-113K is generally used at low concentrations — typically ranging from 0.1% to 2% by weight relative to the epoxy resin — and should be optimized empirically for each system.
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